Beckhoff EL8601-8411 EtherCAT terminal
15 November, 2022The EL8601-8411 EtherCAT terminal offers up to 12 signal interfaces and nine signal types in a 12 mm form factor.
Festo CPX-AP-I decentralised I/O system
07 October, 2022The CPX-AP-I decentralised I/O system is designed to allow I/O modules as well as decentralised valve terminals from Festo to be integrated into host systems.
Before investing in new technology, consider its holistic value
06 October, 2022 by Jim Wallace*, National Sales Manager at Balluff and Open IIoT contributorTruly understanding the value of a project for all stakeholders makes the investment decision easier.
OPCF and FCG to develop a Device Profile for OPC UA Field eXchange
26 August, 2022The OPC Foundation and FieldComm Group are cooperating to develop an Instrumentation Device Profile that will harmonise OPC UA-based field instruments.
Detecting leaks with IO-Link
01 August, 2022At Bürkert we are equipping more and more of our products and components with IO-Link capabilities.
Fieldbus associations collaborate on test plan for TSN
25 July, 2022A single common conformance test plan is to be developed for the IEC/IEEE 60802 TSN Profile for Industrial Automation.
Turck TBEN-S and TBEN-L block I/O modules with Ex approval
28 June, 2022Turck now has Ex approval for its TBEN-S and TBEN-L version IP67 block I/O modules in Zone 2, enabling cabinet-free solutions with IEC Ex and ATEX approvals.
Industrial networks keep growing despite challenging times
01 June, 2022Every year, HMS Networks carries out a study of the industrial network market to analyse the distribution of new connected nodes in factory automation.
Turck TBEC RFID I/O module for EtherCAT
23 May, 2022The Turck TBEC RFID I/O module supports RFID applications with frequent, fast-moving tags and up to 128 read/write heads.
Balluff BNI IO-Link master and I/O modules
26 April, 2022With a new type of housing with a washdown design, Balluff's BNI IO-Link master and I/O modules are suitable wherever there are regular cleaning cycles.
Emerson improves device visibility with FieldComm Group registration
11 March, 2022AMS Device Manager has been registered under the Field Device Integration standard, making it easier to monitor and optimise plant health.
Turck IO-Link masters with power
03 March, 2022Turck has expanded its IO-Link range with an 8-port master with M12 power, a compact 4-port master in IP20 and I/O hubs with an external power supply.
Softing mobiLink Power commissioning interface
20 October, 2021Softing's mobiLink Power commissioning interface now supports Emerson's AMS Instrument Inspector to access FOUNDATION Fieldbus devices.
Turck IO-Link masters and hubs
01 October, 2021Turck has expanded its IO-Link range to include IP69K 8-port IO-Link masters with M12 power supply, IO-Link masters in IP20 and an I/O-Hub with external power.
FDT Group video describes open automation with FDT 3.0
10 September, 2021Video describes open automation transformation enabled by its FDT 3.0 Industrial Internet of Things (IIoT) solutions.
